| Path: | icdoc!tsun1.doc.ic.ac.uk!zmact61 |
| From: | zmact61@tsun1.doc.ic.ac.uk.doc.ic.ac.uk (D Spinellis) |
| Newsgroups: | sci.electronics |
| Subject: | Re: Pressure-sensitive Sensor Pads |
| Summary: | Can use the foam material that is used to ship IC's |
| Message-ID: | <1477@gould.doc.ic.ac.uk> |
| Date: | 24 Jan 90 17:25:45 GMT |
| References: | <108800005@uxa.cso.uiuc.edu> <7956@tekigm2.MEN.TEK.COM> |
| Sender: | news@doc.ic.ac.uk |
| Reply-To: | dds@cc.ic.ac.uk (Diomidis Spinellis) |
| Organization: | Imperial College Department of Computing |
| Lines: | 11 |
| Content-Length: | 638 |
In article <7956@tekigm2.MEN.TEK.COM> chuckj@tekigm2.MEN.TEK.COM (Chuck St. John) writes: >Anybody out there know of a source for pressure-sensitive mat material? The black spongy material that is used to protect IC's from static when shipping them, varies its resistance when pressure is applied to it. Diomidis -- Diomidis Spinellis Internet: dds@cc.ic.ac.uk Department of Computing BITNET: dds@cc.ic.ac.uk Imperial College UUCP: ...!cernvax!cc.imperial.ac.uk!dds London SW7 2BZ JANET: dds@uk.ac.ic.cc
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